DocumentCode :
2474489
Title :
High voltage breakdown of solid epoxies at room temperature and in liquid nitrogen
Author :
James, D.R. ; Sauers, I. ; Pace, M.O. ; Ellis, A.R.
Author_Institution :
Oak Ridge Nat. Lab., TN, USA
fYear :
2002
fDate :
2002
Firstpage :
542
Lastpage :
545
Abstract :
With the development of high temperature superconductors (HTS) in flexible tape form, work has rapidly moved toward high voltage power applications such as HTS power cables, transformers, and fault current limiters. Generic to the design of these devices is the use of solid dielectric material that can hold off high voltages in combination with either vacuum or liquid nitrogen. Several types of epoxies have been screened by subjecting them to "dunk" tests in liquid nitrogen to determine which materials would not crack after immersion. Materials that survived the dunk tests were further tested for dielectric strength at room temperature and at 77 K. Stycast® 2850 FT/24 LV catalyst was found to decrease slightly in strength at 77 K while the Araldite® CY 5808/HY 5808 hardener and Stycast® 2850 KT/11 catalyst significantly increased. These materials are found to follow a Weibull distribution.
Keywords :
Weibull distribution; dielectric materials; electric breakdown; electric strength; epoxy insulation; power cable insulation; thermal shock; 300 K; 77 K; Araldite CY 5808/HY 5808; HTS power cables; Stycast 2850 FT/24 LV; Stycast 2850 KT/11; Weibull distribution; dielectric material; dielectric strength; dunk test; fault current limiters; flexible tape; high temperature superconductors; high voltage breakdown; solid epoxy insulation; thermal shock tests; transformers; Dielectric breakdown; Dielectric materials; Fault current limiters; High temperature superconductors; Materials testing; Nitrogen; Power cables; Solids; Transformers; Weibull distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
Print_ISBN :
0-7803-7502-5
Type :
conf
DOI :
10.1109/CEIDP.2002.1048853
Filename :
1048853
Link To Document :
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