• DocumentCode
    2474496
  • Title

    Mechanisms responsible for dynamic ON-resistance in GaN high-voltage HEMTs

  • Author

    Jin, Donghyun ; Alamo, Jesús A del

  • Author_Institution
    Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2012
  • fDate
    3-7 June 2012
  • Firstpage
    333
  • Lastpage
    336
  • Abstract
    We have developed a new methodology to study the dynamic ON-resistance (RON) of high-voltage GaN High-Electron-Mobility Transistors (HEMTs). With this technique, we have investigated dynamic RON transients over a time span of 11 decades. In OFF to ON time transients, we observe a fast release of trapped electrons through a temperature-independent tunneling process. We attribute this to border traps at the AlGaN barrier/AlN spacer interface. Over a longer time scale, we observe conventional thermally activated electron detrapping from traps at the surface of the device or inside the AlGaN barrier. These findings provide a path for power switching device engineering with minimum dynamic RON.
  • Keywords
    II-VI semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; wide band gap semiconductors; AlGaN-AlN; GaN; dynamic ON-resistance; high-voltage HEMT; high-voltage high-electron- mobility transistors; off time transients; on time transients; power switching device engineering; temperature-independent tunneling process; thermally activated electron detrapping; Aluminum gallium nitride; Electron traps; Gallium nitride; HEMTs; MODFETs; Switches; Transient analysis; GaN; HEMT; border traps; dynamic ON-resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
  • Conference_Location
    Bruges
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4577-1594-5
  • Electronic_ISBN
    1943-653X
  • Type

    conf

  • DOI
    10.1109/ISPSD.2012.6229089
  • Filename
    6229089