Experimental characterization of metal fill placement and size impact on spiral inductors

Author

Shilimkar, Vikas S. ; Gaskill, Steven G. ; Weisshaar, Andreas

Author_Institution

Sch. of Electr. Eng. & Comput. Sci., Oregon State Univ., Corvallis, OR, USA

fYear

2009

fDate

19-21 Oct. 2009

Firstpage

101

Lastpage

104

Abstract

This paper experimentally studies the parasitic impact of metal fill on a spiral inductor fabricated in a 180 nm Bi-CMOS process. Metal fill design aspects such as placement (in-plane vs. off-plane) and size are considered. We demonstrate larger impact on the quality factor (Q) and self-resonance frequency for off-plane metal fill compared to in-plane metal fill. A 70% decrease in fill size with unchanged metal density gives a 13% improvement in measured Q.

Keywords

BiCMOS integrated circuits; Q-factor; inductors; transmission lines; Bi-CMOS process; metal density; metal fill placement; off-plane metal fill; quality factor; self-resonance frequency; size 180 nm; size impact; spiral inductors; transmission lines; Coils; Dielectrics; Inductors; Parasitic capacitance; Q factor; Radio frequency; Signal design; Spirals; Transmission line measurements; Transmission lines; CMP; metal fill; spiral inductors; transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on

Conference_Location

Portland, OR

Print_ISBN

978-1-4244-4447-2

Electronic_ISBN

978-1-4244-5646-8

Type

conf

DOI

10.1109/EPEPS.2009.5338466

Filename

5338466