Title :
Thermally induced shifts in an optical fiber soldered into a ferrule
Author :
Chang, H.L. ; Wang, S.C. ; Wang, C. ; Wang, C.M. ; Liaw, J.W. ; Sheen, M.T. ; Sheu, Y.C. ; Kuang, J.H. ; Chen, C.H. ; Chien, C.P. ; Cheng, W.H.
Author_Institution :
Chunghwa Telecom Lab., Taoyuan, Taiwan
Abstract :
The thermally induced fiber shifts under a temperature cycling test of an optical fiber soldered into a ferrule packaging was measured experimentally. Up to a 0.18 μm of the fiber shift was found in temperature cycling from -40 to +85°C. This fiber displacement may arise from both the relief of the residual stresses and the intermetallic compound growth within the solder during the temperature cycling test. A finite-element method (FEM) analysis was also performed on the calculation of the up-bound fiber shift. Results showed that up to a 0.27 μm of the fiber shift was predicted. This indicates that the FEM is an effective method for predicting the up-bound fiber shifts in temperature cycling test for laser module reliability study
Keywords :
internal stresses; modules; optical communication equipment; optical testing; packaging; reliability; semiconductor lasers; thermal stresses; -40 to 85 C; FEM; ferrule; finite-element method; intermetallic compound growth; laser module reliability study; optical fiber soldering; residual stresses; temperature cycling; temperature cycling test; thermally induced fiber shifts; thermally induced shifts; up-bound fiber shift; Assembly; Displacement measurement; Fiber lasers; Finite element methods; Optical fiber testing; Optical fibers; Packaging; Residual stresses; State feedback; Temperature;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-4947-4
DOI :
10.1109/LEOS.1998.739759
