• DocumentCode
    2474637
  • Title

    11E-3 A Thermally Stable CMOS Oscillator Using Temperature Compensated FBAR

  • Author

    Pang, Wei ; Ruby, Rich C. ; Parker, Reed ; Fisher, Philip W. ; Larson, John D., III ; Grannen, Kevin J. ; Lee, Donald ; Feng, Chris ; Callaghan, Lori

  • Author_Institution
    Avago Technol., San Jose
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    1041
  • Lastpage
    1044
  • Abstract
    This paper presents a passively temperature compensated CMOS oscillator utilizing Film Bulk Acoustic Resonator (FBAR). The resonator exhibiting f-Q product of 2~3times1012 sec-1 is comprised of molybdenum (Mo), aluminum nitride (AlN), and a compensation material that has positive temperature coefficient of Young´s modulus. The 600 MHz oscillator consumes 6.6 mW from a 3.3 V supply and achieves an excellent phase noise performance of -102 dBc/Hz, -132 dBc/Hz, and -151 dBc/Hz at 1 kHz, 10 kHz, and 100 kHz carrier offset, respectively. The oscillator´s temperature-dependent frequency drift is less than 80 parts per million (ppm) over a temperature range of -35 to +85degC.
  • Keywords
    Young´s modulus; acoustic resonators; aluminium compounds; molybdenum; phase noise; ultrasonics; CMOS oscillator; Young modulus; aluminum nitride; film bulk acoustic resonator; frequency 600 MHz; molybdenum; Clocks; Consumer electronics; Film bulk acoustic resonators; Frequency; Micromechanical devices; Oscillators; Phase noise; Stability; Temperature distribution; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1384-3
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.263
  • Filename
    4409836