DocumentCode :
2474670
Title :
Correlation of mechanical properties with electrical treeing behaviour at elevated temperatures
Author :
Auckland, D.W. ; Taha, A. ; Varlow, B.R.
Author_Institution :
Dept. of Electr. Eng., Manchester Univ., UK
fYear :
1993
fDate :
17-20 Oct 1993
Firstpage :
636
Lastpage :
641
Abstract :
The mechanical properties and corresponding treeing behavior over a wide range of temperatures was measured in both polyester and epoxy resins. Young´s modulus, tensile strength, and fracture toughness show a definite decrease in value as the temperature is increased. The material´s resistance to crack propagation therefore becomes lower with the application of heat. The main reason for the degradation in mechanical properties is that the material passes through its glass transition point, Tg, during the range of test temperatures. The treeing resistance displays a similar fall as the temperature is increased. The results of the treeing tests show a rapid deterioration in tree resistance, as evidenced by a sharp fall in the number of cycles of applied voltage to produce tree growth to breakdown, which follows the decline in mechanical characteristics in the same temperature range from Tg
Keywords :
Young´s modulus; epoxy insulation; fracture toughness; glass transition; insulation testing; life testing; mechanical properties; organic insulating materials; tensile strength; trees (electrical); Young´s modulus; electrical treeing behaviour; elevated temperatures; epoxy resins; fracture toughness; glass transition point; mechanical properties; polyester; tensile strength; Breakdown voltage; Degradation; Electric resistance; Electrical resistance measurement; Epoxy resins; Mechanical factors; Mechanical variables measurement; Resistance heating; Temperature distribution; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1993. Annual Report., Conference on
Conference_Location :
Pocono Manor, PA
Print_ISBN :
0-7803-0966-9
Type :
conf
DOI :
10.1109/CEIDP.1993.378901
Filename :
378901
Link To Document :
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