Title :
Through silicon via (TSV) equalizer
Author :
Kim, Joohee ; Song, Eakhwan ; Cho, Jeonghyeon ; Jim So Pak ; Lee, Junho ; Lee, Hyungdong ; Park, Kunwoo ; Kim, Joungho
Author_Institution :
Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
Through silicon via (TSV) is a promising vertical interconnection method to achieve a 3-dimensional integrated circuit (3D IC) system. However, high-speed digital signals suffer from severe distortions induced by TSV interconnects. In this paper, we propose a TSV equalizer using an ohmic contact on a double-sided silicon interposer to reduce the inter-symbol interference (ISI) of the TSV interconnects in a 3D IC system.
Keywords :
elemental semiconductors; equalisers; high-speed integrated circuits; integrated circuit interconnections; ohmic contacts; silicon; 3-dimensional integrated circuit system; TSV interconnects; double-sided silicon interposer; high-speed digital signal distortion; inter-symbol interference reduction; through-silicon via equalizer; vertical interconnection method; Attenuation; Contact resistance; Equalizers; Integrated circuit interconnections; Integrated circuit technology; Intersymbol interference; Ohmic contacts; Silicon; Three-dimensional integrated circuits; Through-silicon vias;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338488
