Title :
Extraction of via and trace model from PCB channel S-parameter data by stochastic optimization
Author :
Lee, Juyoung ; Doblar, Drew
Author_Institution :
Sun Microsyst. Inc., Santa Clara, CA, USA
Abstract :
A new method to extract via and trace model from given S-parameter data of PCB channels with symmetrical ends is presented. By applying stochastic optimization to two channels of different channel lengths, the two-port s-matrix of via and trace can be accurately determined by searching the multi-dimensional parameter space.
Keywords :
S-matrix theory; S-parameters; printed circuits; stochastic processes; PCB channel; S-parameter data; multidimensional parameter space; stochastic optimization; trace model; two-port s-matrix; via model; Data mining; Equations; Impedance; Insertion loss; Propagation losses; Scattering parameters; Stochastic processes; Symmetric matrices; Testing; Transmission line matrix methods;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338491
