Abstract :
Presents the introductory welcome message from the conference proceedings.
Keywords :
Educational institutions; Electronics industry; Electronics packaging; Government; High-speed electronics; Laboratories; Meeting planning; Performance analysis; Radio frequency; Signal analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
DOI :
10.1109/EPEPS.2009.5338492
