Title :
Embedded tutorial: Challenges in high frequency measurement and simulation comparisons
Author :
Melde, Kathleen L. ; Burcham, T.
Author_Institution :
Electr. & Comput. Eng. Dept., Univ. of Arizona, Tucson, AZ, USA
Abstract :
High frequency modeling and simulation tools can be used to rapidly develop new packaging structures, yet the models must often be verified by comparison to broadband measurements. This tutorial will discuss some of the key issues involved in an accurate comparison of electromagnetic simulations with measurements. The important factors to consider include which measurement calibration method to use, how to fabricate the necessary calibration artifacts, and the impact that the calibration method may have on the measurement results. The increase in clock speeds and the push to higher frequencies of operation mean that many of the measurement approaches typically used at lower frequencies must be re-evaluated. The verification of accurate high frequency design and analysis tools mean that the measured results on the test structures must also be very accurate at increasingly higher frequencies.
Keywords :
calibration; broadband measurements; calibration artifacts; electromagnetic simulation; high frequency design; high frequency measurement; high frequency modeling; high frequency simulation; measurement calibration; packaging structures; test structures; Calibration; Clocks; Electromagnetic measurements; Frequency measurement; Marketing management; Microwave amplifiers; Packaging; Testing; Tutorial; Velocity measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338494