Title :
Table of contents
Abstract :
The following topics are dealt with: electrical performance; electronic packaging; signal integrity; power integrity; high speed links; on-chip issues; and EM modeling.
Keywords :
electronics packaging; EM modeling; electrical performance; electronic packaging; high speed links; on-chip issues; power integrity; signal integrity;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
DOI :
10.1109/EPEPS.2009.5338497
