Title :
VCSEL-based micro-optical systems
Author :
Warren, M.E. ; Wendt, J.R. ; Sweatt, W.C. ; Nevers, J.A. ; Bailey, C.G. ; Arnold, D.W. ; Matzke, C.M. ; Allerman, A.A. ; Asbill, R.E. ; Carter, T.R. ; Samora, S.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
This is a brief description of work at Sandia National Laboratories to build miniature systems that incorporate VCSELs, micro-optics and other optoelectronic components to realize sensing systems for unique applications. Miniaturization is the primary driver for these designs. The systems are fabricated with a combination of hybrid circuit assembly techniques and advanced electronic packaging technologies, including flip-chip bonding
Keywords :
micro-optics; surface emitting lasers; VCSEL; electronic packaging; fabrication; flip-chip bonding; hybrid circuit assembly; micro-optical system; miniaturization; optoelectronic component; sensing system; Assembly systems; Bonding; Fluorescence; Lenses; Microoptics; Monitoring; Optical pumping; Optical sensors; Sensor arrays; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-4947-4
DOI :
10.1109/LEOS.1998.739786
