DocumentCode :
2475474
Title :
Application of TSDC technique in study of relaxation during curing process of RTV silicone rubbers
Author :
Wang, M.-S.E. ; Gubanski, S.M.
Author_Institution :
Electric Power Res. Center, R. Inst. of Technol., Stockholm, Sweden
fYear :
1993
fDate :
17-20 Oct 1993
Firstpage :
426
Lastpage :
431
Abstract :
Two types of room-temperature-vulcanized silicone rubber high-voltage outdoor insulator coatings were cured for different periods up to 600 hours at 25°C and 80% relative humidity. The thermally stimulated discharging current (TSDC) of samples with different curing degrees, ie., being cured for different periods, was measured at a heating rate of 7°C/min over the temperature range of 25 to 180°C. It was found that the TSD current peak temperature, Tm , increased with increase of curing period, and saturated finally at a stabilized value when the curing process was completed. The net increases of TmS, from the beginning to the completion of the curing, were 25 and 35°C, respectively, for the two types of samples. A logarithmic relationship between the Tm and the curing time, tc, was established on the basis of experimental data. An expression for the relaxation time in the terms of tc was derived based on the TSDC theory
Keywords :
insulating coatings; polymerisation; silicone rubber; thermally stimulated currents; 25 degC; 25 to 180 degC; 600 hours; RTV silicone rubbers; TSD current peak; TSDC technique; curing process; heating rate; logarithmic relationship; relaxation; relaxation time; room-temperature-vulcanized silicone rubber high-voltage outdoor insulator coatings; thermally stimulated discharging current; Curing; Current measurement; Dielectrics and electrical insulation; Heating; Instruments; Rubber; Strontium; Temperature; Time measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1993. Annual Report., Conference on
Conference_Location :
Pocono Manor, PA
Print_ISBN :
0-7803-0966-9
Type :
conf
DOI :
10.1109/CEIDP.1993.378935
Filename :
378935
Link To Document :
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