Title :
Online non-contact fault detection of LED chips
Author :
Li, Lian ; Wen, Jing ; Li, Ping ; Wen, Yumei ; Yin, Fei
Author_Institution :
Key Lab. for Opto-Electron. Technol. & Syst. of Minist. of Educ., Chongqing Univ., Chongqing
Abstract :
An online non-contact fault detection Method of LED chips is presented based on the photovoltaic effect in diodes. By observing the photo-generated current in the bonding lead frame of a LED chip, the LED chip and its electric connection with the lead frame during packaging are checked. The fault detection principle is described in detail in this paper. By using the method based on the law of electromagnetic induction, the photo-generated current can be measured without any touch. The experimental results show that the method can be easily realized, and thus can be used for online fault detection of LED chips in packaging.
Keywords :
fault diagnosis; integrated circuit packaging; light emitting diodes; LED chips; diodes; electromagnetic induction; online noncontact fault detection; photogenerated current; photovoltaic effect; Bonding; Current measurement; Electrical fault detection; Electromagnetic induction; Electromagnetic measurements; Fault detection; Light emitting diodes; Packaging; Photovoltaic effects; Semiconductor device measurement; LED; non-contact detection; online detection; packaging; photovoltaic effect;
Conference_Titel :
Intelligent Control and Automation, 2008. WCICA 2008. 7th World Congress on
Conference_Location :
Chongqing
Print_ISBN :
978-1-4244-2113-8
Electronic_ISBN :
978-1-4244-2114-5
DOI :
10.1109/WCICA.2008.4592937
