A novel through via for printed circuit boards at millimeter-wave frequencies

In this paper, a novel millimeter-wave microstrip-to-microstrip transition is demonstrated for electrically thick substrate (t>λ/4). The design maintains the same EM mode throughout the transition area, thus obtaining excellent matching and loss performance. Simulated result shows that the proposed design performs well up to 40GHz for microstrip lines on a 100mils multilayer PCB with less than 1.5dB loss. This design is compatible with conventional PCB fabrication, thus no additional cost is added.