• DocumentCode
    2475830
  • Title

    Obtaining the electrical parameters of the predischarge in air by using digitized voltage waveforms

  • Author

    Becerra, M. ; Roman, F.

  • Author_Institution
    Univ. Nacional de Colombia, Bogota, Colombia
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    810
  • Lastpage
    813
  • Abstract
    Important information about the physics of the discharge process can be obtained by analyzing the dynamic behavior of the circuit electrical parameters voltage, current, resistance and energy. However, the normalized testing procedures ignore these parameters and the breakdown probabilities of the insulation are presented only in terms of a breakdown probability voltage (mainly 10% or 50%), or in terms of a discharge probability function. To use the enormous amount of information obtained during an impulse voltage test procedure and to take advantage of the use of computers in high-voltage laboratories, the Single Stress Method -SSM- has been proposed. As it is explained in the present paper, the captured oscillographic digitized voltage waveforms obtained during the application of the SSM test procedure were processed. Numerical methods were used to derive the non-measured parameters of the circuit: current, resistance and energy dissipated in the discharge path.
  • Keywords
    air insulation; discharges (electric); electric variables measurement; equivalent circuits; high-voltage techniques; insulation testing; HV test environment; air insulation; breakdown probability; circuit electrical parameters; digitized voltage waveforms; discharge process; dynamic behavior; equivalent impulse generator circuit; high-voltage laboratories; impulse voltage test procedure; predischarge electrical parameters; single stress method; Application software; Breakdown voltage; Circuit testing; Electric resistance; Impulse testing; Information analysis; Insulation testing; Laboratories; Physics; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
  • Print_ISBN
    0-7803-7502-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2002.1048919
  • Filename
    1048919