DocumentCode
2475946
Title
Thermal Characteftistics of Potted Electronic Modules
Author
Gonzales, J.I. ; Waugh, C.E.
fYear
1962
fDate
1962
Firstpage
105
Lastpage
119
Keywords
Analytical models; Electronic packaging thermal management; Electronics packaging; Heat sinks; Heat transfer; Reliability engineering; Space heating; Temperature; Testing; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
1962 IRE National Convention
Type
conf
DOI
10.1109/IRENC.1962.199230
Filename
1536170
Link To Document