Title :
Thermal Characteftistics of Potted Electronic Modules
Author :
Gonzales, J.I. ; Waugh, C.E.
Keywords :
Analytical models; Electronic packaging thermal management; Electronics packaging; Heat sinks; Heat transfer; Reliability engineering; Space heating; Temperature; Testing; Transient analysis;
Conference_Titel :
1962 IRE National Convention
DOI :
10.1109/IRENC.1962.199230
