Title :
High-Density-Package Joining Techniques
Author :
Johnson, Charles W. ; Konsowski, Steven G.
Keywords :
Circuits; Costs; Environmental economics; Flexible manufacturing systems; Heat sinks; Lead; Packaging; Process control; Soldering; Welding;
Conference_Titel :
1962 IRE National Convention
DOI :
10.1109/IRENC.1962.199231
