• DocumentCode
    2476
  • Title

    Triband Filter Design Using Laminated Waveguide Cavity in LTCC

  • Author

    Wan-Ling Tsai ; Tze-Min Shen ; Bo-Jiun Chen ; Ting-Yi Huang ; Ruey-Beei Wu

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    4
  • Issue
    6
  • fYear
    2014
  • fDate
    Jun-14
  • Firstpage
    957
  • Lastpage
    966
  • Abstract
    This paper demonstrates the flexibility and superiority of multilayer low-temperature cofired ceramic structures in realizing filters with multifunction features. A systematic synthesis technique is employed to develop triband laminated waveguide filters with minimum number of resonators and improved band allocation. By exploiting the multiple resonant modes inside a cavity, the coupling mechanisms and feeding design for different bands can be selectively controlled in accordance with the modal field distributions. Thus, the different passbands can be treated with different methodologies to achieve the multiband function with flexible band allocation. A triband filter operated at 30, 35, and 37 GHz with a fourth-order quasi-elliptic response for the first band and a split-type response for the last two bands is developed. It shows only four cavities are needed with the overall circuit size of 4.9 × 4.1 × 0.88 mm3. Experimental and simulated results are in good agreement, both validate the design concept.
  • Keywords
    cavity resonator filters; ceramic packaging; flexible electronics; waveguide filters; LTCC; flexible band allocation; fourth-order quasielliptic response; laminated waveguide cavity; multilayer low-temperature cofired ceramic structures; multiple resonant modes; resonators; split-type response; triband filter design; triband laminated waveguide filters; Cavity resonators; Couplings; Magnetic resonance; Passband; Q-factor; Resource management; Band allocation; laminated waveguide; low-temperature cofired ceramics (LTCCs); triband filter; triband filter.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2014.2319299
  • Filename
    6814774