DocumentCode
2476222
Title
A new test to characterise low voltage cables subjected to thermal and mechanical stresses
Author
Guastavino, F. ; Centurioni, L. ; Torello, E. ; Zaopo, A.
Author_Institution
Electr. Eng. Dept., Univ. of Genova, Italy
fYear
2002
fDate
2002
Firstpage
873
Lastpage
877
Abstract
During the service, electric cables for low voltage (450/750 V) systems can be subjected both to thermal stress due to the high current caused by short circuits in the system and to mechanical stresses due to the laying conditions. The behaviour of two different kinds of cables, when subjected to such thermal and mechanical stresses, was considered: a PVC insulated cable not propagating fire and a very low (smoke and toxic gasses) emission cable insulated by a LSOH compound. An "ad hoc" test cell was designed to study the above insulating materials subjected to the combined stresses. As to the thermal stress, the specimens (a part of a 1.5 mm2 cable) were subjected to sinusoidal current waves (hundreds of Ampere amplitude, lasting 100 ms) sequentially applied every 5 seconds. The mechanical stress was obtained applying a high pressure crushing the cable to four suitable cylindrical supports. When any cylinder got in contact with the specimen cable copper, an electrical current flew through that cylinder to ground and a max current relay was tripped, stopping the aging test. The proposed test cell and procedure, could be considered as a new "type test" useful to characterize low voltage cables insulation in presence of both thermal and mechanical stresses.
Keywords
cable insulation; cable testing; mechanical testing; thermal stresses; 100 ms; 450 V; 5 sec; 750 V; aging test; electrical current; high pressure crushing; low voltage cables; mechanical stresses; short circuits; sinusoidal current waves; thermal stresses; very low smoke emission cable; very low toxic gasses emission cable; Cable insulation; Circuit testing; Contacts; Fires; Gas insulation; Insulation testing; Low voltage; Materials testing; Mechanical cables; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
Print_ISBN
0-7803-7502-5
Type
conf
DOI
10.1109/CEIDP.2002.1048934
Filename
1048934
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