Title :
Ultrasonic image formation of electrical breakdown region in epoxy resin blended with silica powder as filler material
Author :
Ohara, Toshihiko ; Watanabe, Eiki ; Iino, M.
Author_Institution :
Dept. of Electr. Eng., Tokyo Metropolitan Univ., Japan
Abstract :
The only practical way to visualize the electrical breakdown region in insulating materials has long been to section a specimen with a cutting machine like microtome, since they are usually opaque, or at best, translucent. We already demonstrated that electrical trees in simple materials, e.g., polyethylene, could be inspected by an ultrasonic visualization method. As the next step of our study, we began to try to obtain ultrasonic images of the electrical breakdown region that was formed in compound material blended with filler powder. However, it was difficult by far, as was expected, to make the ultrasonic image because the reflection signal from the target (electrical breakdown region) was screened by heavy scattering noises dispersed by filler particles. So we prepared the specimens in which silica powder with different particle sizes and contents were blended. From the experimental results, it became clear that when the mean diameter of filler particle was smaller than the value determined by the theory of Rayleigh scattering, the influence of scattering was reduced abruptly and clear ultrasonic images could be obtained.
Keywords :
Rayleigh scattering; electric breakdown; epoxy insulation; filled polymers; particle size; silicon compounds; ultrasonic imaging; Rayleigh scattering; SiO2; electrical breakdown region; epoxy resin; filler powder; insulating materials; particle sizes; scattering noise; silica powder; ultrasonic image formation; Dielectrics and electrical insulation; Electric breakdown; Epoxy resins; Particle scattering; Polyethylene; Powders; Rayleigh scattering; Silicon compounds; Trees - insulation; Visualization;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
Print_ISBN :
0-7803-7502-5
DOI :
10.1109/CEIDP.2002.1048938