Title :
P1H-4 FBAR Characteristics with AlN Film Using MOCVD Method and Ru/Ta Electrode
Author :
Aota, Y. ; Tanifuji, S. ; Oguma, H. ; Kameda, S. ; Nakase, H. ; Takagi, T. ; Tsubouchi, K.
Author_Institution :
Tohoku Univ., Sendai
Abstract :
Film bulk acoustic resonator (FBAR) was fabricated using high oriented AlN(0002) film obtained through the metal-organic chemical vapor deposition (MOCVD) method. We used the Ru/Ta bottom electrode to improve the FBAR resonant characteristics because Ru has a high acoustic impedance and a hexagonal crystalline that is effective to obtaine the high oriented AlN(0002) film. The Ru/Ta electrode had good characteristics under 1100degC in points of the full width at half maximum (FWHM) of Ru(0002), the surface roughness and the electrode resistivity. The evaluated FWHM of AlN(0002) on Ru/Ta at 1050degC was exellent value of 1.2deg. The resonant frequency and anti-resonant frequency of the fabricated FBAR using the Ru/Ta bottom electrode were 5.217 GHz and 5.479 GHz, respectively. The resistance of the FBAR electrodes and of the series-resonance part in modified Butterworth Van Dyke (MBVD) equivalent circuit were improved to 4.3 Omega from 7.0 Omega and to 0.5 Omega from 3.0 Omega compared to the results of previous Mo bottom electrode, respectively. The effective electro-mechanical coupling coefficient (keff 2) of the fabricated FBAR was exellent value of 7.0 % and the evaluated Qr was 329. We successfully fabricated the FBAR with the small insertion loss and the large keff 2 using the Ru/Ta bottom electrode and high oriented AlN(0002) film.
Keywords :
III-V semiconductors; MOCVD; acoustic resonators; aluminium compounds; bulk acoustic wave devices; electrodes; equivalent circuits; piezoelectric thin films; ruthenium; semiconductor thin films; tantalum; thin film devices; wide band gap semiconductors; AlN; AlN film; Butterworth Van Dyke equivalent circuit; FBAR electrodes; FBAR resonant characteristics; MOCVD; Ru-Ta; Ru-Ta electrode; acoustic impedance; electro-mechanical coupling coefficient; electrode resistivity; film bulk acoustic resonator; frequency 5.217 GHz; frequency 5.479 GHz; insertion loss; metal-organic chemical vapor deposition; surface roughness; temperature 1050 C; temperature 1100 C; Chemical vapor deposition; Crystallization; Electrodes; Film bulk acoustic resonators; MOCVD; Resonance; Rough surfaces; Surface impedance; Surface resistance; Surface roughness;
Conference_Titel :
Ultrasonics Symposium, 2007. IEEE
Conference_Location :
New York, NY
Print_ISBN :
978-1-4244-1384-3
Electronic_ISBN :
1051-0117
DOI :
10.1109/ULTSYM.2007.358