DocumentCode
2477232
Title
Theory and characterization of a top-thread coverstitched stretch sensor
Author
Gioberto, Guido ; Dunne, Lucy
Author_Institution
Dept. of Comput. Sci. & Eng., Univ. of Minnesota, Minneapolis, MN, USA
fYear
2012
fDate
14-17 Oct. 2012
Firstpage
3275
Lastpage
3280
Abstract
One of the chief challenges of wearable sensing is adapting electronic components and sensors to the wearable environment. Electronic components are often rigid, bulky, and impermeable: factors that usually detract from wearing comfort. Here, we present a novel stretch sensor fabricated using the top thread of a standard industrial coverstitch machine. The machine is common in apparel production and offers the ability to easily fabricate custom-placed stretch sensors on textile and apparel products. The sensing properties of the stitch are enabled by a conductive thread which increases its electric resistance as the fabric is stretched, due to the geometry of the stitches. Our empirical analysis shows a sensor response in the order of 10 ohms, with almost linear behavior prior to saturation (when the stitch is fully stretched) for low-frequency extensions of 119% of initial sample length. An equivalent electrical model is presented for theoretical modeling of the sensor behavior.
Keywords
electric resistance; sensors; textile products; apparel production; conductive thread; custom-placed stretch sensors fabrication; electric resistance; electronic components adaptation; equivalent electrical model; low-frequency extensions; novel stretch sensor fabrication; sensor adaptation; sensor behavior modeling; sensor response; standard industrial coverstitch machine; stitch sensing properties; stitches geometry; top-thread coverstitched stretch sensor; wearable environment; wearable sensing; Clothing; Electrical resistance measurement; Fabrics; Resistance; Sensors; Yarn; e-textile; sensor; wearable technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Systems, Man, and Cybernetics (SMC), 2012 IEEE International Conference on
Conference_Location
Seoul
Print_ISBN
978-1-4673-1713-9
Electronic_ISBN
978-1-4673-1712-2
Type
conf
DOI
10.1109/ICSMC.2012.6378296
Filename
6378296
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