DocumentCode :
2477431
Title :
Architectural trade-offs for SiGe BiCMOS direct conversion receiver front-ends for IEEE802.11a
Author :
Chakraborty, S. ; Reynolds, S.K. ; Beukema, T. ; Ainspan, H. ; Laskar, J.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2002
fDate :
20-23 Oct. 2002
Firstpage :
120
Lastpage :
123
Abstract :
We present two different approaches towards development of direct conversion receiver front-ends for IEEE802.11a applications in IBM´s SiGe BiCMOS technology. These approaches include: a) conventional 50 /spl Omega/ system, b) fully monolithic front-end. The developed ICs are targeted for the upper U-NII band at frequency range of 5.725-5.825 GHz and include a low noise amplifier (LNA), two mixers in quadrature, and a frequency divider. All of these circuits use fully on chip implementation. The LNA provides a gain of 11 dB, noise figure of 4.4 dB, IIP3 of -2dBm and occupies an area of 0.7 mm/spl times/0.7 mm. A micromixer topology has been adopted in the case of the 50 /spl Omega/ system and provides 9.2 dB gain, input matching of 16 dB, double sideband noise figure of 19.5 dB, input 1 dB compression point of -3 dBm, IIP3 and IIP2 of +6 and +32 dBm respectively and occupies an area of 1.6 mm/spl times/1 mm. The fully integrated receiver utilizes single-ended Gilbert cell mixers, and occupies a compact area of 1.6 mm/spl times/1.3 mm. It exhibits 20.2 dB gain, input 1 dB compression point (input P1dB) of -15.5 dBm, input matching of 15 dB, IIP3 and IIP2 of -3 dBm and +31 dBm respectively, double sideband noise figure of 7.1 dB, and LO to RF leakage of 78 dB. The LNA draws 5.78 mA from a 2.8 V supply, both micromixers draw 10.3 mA from 3.1 V supply, both Gilbert cell mixers draw 12.71 mA from a 3.75 V supply, and the frequency divider draws 22 mA from a 3.75 V supply.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; IEEE standards; MMIC amplifiers; MMIC mixers; frequency dividers; integrated circuit design; integrated circuit measurement; integrated circuit noise; microwave receivers; semiconductor materials; wireless LAN; 0.7 mm; 1 mm; 1.3 mm; 1.6 mm; 10.3 mA; 11 dB; 12.71 mA; 19.5 dB; 2.8 V; 20.2 dB; 22 mA; 3.1 V; 3.75 V; 4.4 dB; 5.725 to 5.825 GHz; 5.78 mA; 50 ohm; 7.1 dB; 9.2 dB; IEEE 802.11a WLAN applications; LNA chip area; LNA gain/noise figure; LNA supply voltage/current consumption; LO to RF leakage; SiGe; SiGe BiCMOS direct conversion receiver front-ends; compression point; double sideband noise figure; frequency dividers; input matching; low noise amplifiers; micromixer topology; quadrature mixers; single-ended Gilbert cell mixers; upper U-NII band frequency range; wireless LAN standards; BiCMOS integrated circuits; Circuit noise; Frequency conversion; Gain; Germanium silicon alloys; Impedance matching; Low-noise amplifiers; Mixers; Noise figure; Silicon germanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2002. 24th Annual Technical Digest
Conference_Location :
Monterey, California, USA
ISSN :
1064-7775
Print_ISBN :
0-7803-7447-9
Type :
conf
DOI :
10.1109/GAAS.2002.1049043
Filename :
1049043
Link To Document :
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