• DocumentCode
    2477601
  • Title

    P2E-3 Power Harvesting Using Piezoelectric MEMS Generator with Interdigital Electrodes

  • Author

    Lee, B.S. ; Wu, W.J. ; Shih, W.-P. ; Vasic, D. ; Costa, F.

  • Author_Institution
    Nat. Taiwan Univ., Taipei
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    1598
  • Lastpage
    1601
  • Abstract
    The energy harvesting from ambiance to power the tiny sensor devices by MEMS generator is becoming practical due to the power consumption of low power VLSI (very large scale integration) circuits is going down to tens to hundreds muW for integrated wireless sensor devices. In this paper, we present the design and process development of a piezoelectric MEMS generator that has the ability to scavenge mechanical energy of ambient vibrations and transform it into electrical energy. The piezoelectric MEMS generator comprises a beam structure based on the silicon wafer with laminated PZT (lead zirconate titanate) material and interdigital electrodes on the top of the PZT layer, to transform mechanical strain energy into electrical charge using the d33 mode of PZT. An in-house developed PZT deposition chamber which could deposit PZT thin film up to tens micron in minutes was used to deposit the piezoelectric layer on the beam structure of the piezoelectric MEMS generator. The output power performance and output voltage with varied gaps of the interdigital electrodes are evaluated and detailed in this paper.
  • Keywords
    VLSI; lead compounds; low-power electronics; micromechanical devices; microsensors; piezoelectric devices; power integrated circuits; PZT; PZT thin film; electrical energy; integrated wireless sensor device; interdigital electrodes; low power VLSI circuit; mechanical strain energy; piezoelectric MEMS generator; power consumption; power harvesting; silicon wafer; tiny sensor device; Circuits; Electrodes; Energy consumption; Mechanical energy; Mechanical sensors; Micromechanical devices; Power generation; Process design; Very large scale integration; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1383-6
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.402
  • Filename
    4409975