DocumentCode
2478083
Title
High-performance and high-uniformity InP/InGaAs/InP DHBT technology for high-speed optical communication systems
Author
Yang, Y. ; Frackoviak, J. ; Liu, C.T. ; Chen, C.J. ; Chua, L.-L. ; Sung, W.J. ; Tate, A. ; Tong, J. ; Reyes, R. ; Kopf, R. ; Ruel, R. ; Werder, D. ; Houtsma, V. ; Georgiou, G. ; Weiner, J.S. ; Baeyens, Y. ; Chen, Y.K.
Author_Institution
Lucent Technol. Bell Labs., Murray Hill, NJ, USA
fYear
2002
fDate
20-23 Oct. 2002
Firstpage
269
Lastpage
272
Abstract
Recently, InP/InGaAs/InP double-heterostructure bipolar transistors (DHBT) have attracted a lot of attention in the realization of high-speed (>40 Gb/s) optical communication systems (G. Raghaven et al., IEEE Spectrum, Oct. 2000; Y. Baeyens et al, IEEE GaAs IC Symp. Tech. Dig., pp. 125-128, 2001; Y.K. Chen et al., IEDM Tech. Dig., 2001, and OFC Tech. Dig., 2002). Much progress has been made to improve the high-speed device performance and f/sub T/ values as high as 340 GHz have been reported (S. Lee et al, IEEE GaAs IC Symp. Tech. Dig., pp. 185-187, 2001; A. Fujihara et al., IEDM Tech. Dig., 2001; M. Ida et al., ibid., 2001.). However to our knowledge there have been few reports on the reproducibility, yield and robustness of these types of devices. For successful implementation of these devices in high speed ICs, in addition to high f/sub T/ and f/sub max/, a useful DHBT technology also needs to achieve low turn-on voltage V/sub ce,sat/, low knee voltage V/sub k/, high breakdown voltages BVCEO, BVCBO, and on-state breakdown voltage. Furthermore, excellent device yield, high circuit-performance and uniformity are required. Optimization of all these parameters is critical for any given technology to be practically useful. In this paper, we report on a high-yield, high performance InP/InGaAs DHBT process with excellent uniformity and reproducibility.
Keywords
III-V semiconductors; bipolar integrated circuits; gallium arsenide; heterojunction bipolar transistors; high-speed integrated circuits; indium compounds; integrated circuit reliability; integrated circuit yield; optical communication equipment; semiconductor device breakdown; semiconductor device reliability; 340 GHz; 40 Gbit/s; InP-InGaAs-InP; InP/InGaAs DHBT process; InP/InGaAs/InP DHBT technology; InP/InGaAs/InP double-heterostructure bipolar transistors; circuit performance; device reproducibility; device robustness; device uniformity; device yield; high speed IC; high-performance high-uniformity DHBT technology; high-speed device performance; high-speed optical communication systems; knee voltage; on-state breakdown voltage; optimization; turn-on voltage; Bipolar transistors; Breakdown voltage; DH-HEMTs; Gallium arsenide; Indium gallium arsenide; Indium phosphide; Low voltage; Optical fiber communication; Reproducibility of results; Robustness;
fLanguage
English
Publisher
ieee
Conference_Titel
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2002. 24th Annual Technical Digest
Conference_Location
Monterey, California, USA
ISSN
1064-7775
Print_ISBN
0-7803-7447-9
Type
conf
DOI
10.1109/GAAS.2002.1049075
Filename
1049075
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