• DocumentCode
    2480192
  • Title

    Robust optimization of a Chip Multiprocessor´s performance under power and thermal constraints

  • Author

    Ghasemazar, Mohammad ; Goudarzi, Hadi ; Pedram, Massoud

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    2012
  • fDate
    Sept. 30 2012-Oct. 3 2012
  • Firstpage
    108
  • Lastpage
    114
  • Abstract
    Power dissipation and die temperature have become key performance limiters in today´s high-performance Chip Multiprocessors (CMPs.) Dynamic power management solutions have been proposed to manage resources in a CMP based on the measured power dissipation, performance, and die temperature of processing cores. In this paper, we develop a robust framework for power and thermal management of heterogeneous CMPs subject to variability and uncertainty in system parameters. More precisely, we first model and formulate the problem of maximizing the task throughput of a heterogeneous CMP (a.k.a., asymmetric multi-core architecture) subject to a total power budget and a per-core temperature limit. Next we develop a solution framework, called Variation-aware Power/Thermal Manager (VPTM), which is a hierarchical dynamic power and thermal management solution targeting heterogeneous CMP architectures. VPTM utilizes dynamic voltage and frequency scaling (DVFS) and core consolidation techniques to control the core power consumptions, which implicitly regulate the core temperatures. An algorithm is proposed for core consolidation and application assignment, and a convex program is formulated and solved to produce optimal DVFS settings. Finally, a feedback controller is employed to compensate for variations in key system parameters at runtime. Experimental results show highly promising performance improvements for VPTM compared to the state-of-the-art techniques.
  • Keywords
    cooling; feedback; microprocessor chips; optimisation; power aware computing; resource allocation; temperature control; thermal management (packaging); VPTM; convex programming; core consolidation techniques; core power consumption control; core temperature regulation; die temperature; dynamic power management solutions; dynamic voltage and frequency scaling; feedback controller; heterogeneous CMP; high-performance CMP; high-performance chip multiprocessors; key performance limiters; key system parameters; optimal DVFS settings; per-core temperature limit; power constraints; power dissipation measurement; processing cores; resource management; robust optimization; system parameters. uncertainty; thermal constraints; total power budget; variation-aware power-thermal management; Power demand; Power dissipation; Temperature control; Temperature measurement; Thermal management; Throughput; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design (ICCD), 2012 IEEE 30th International Conference on
  • Conference_Location
    Montreal, QC
  • ISSN
    1063-6404
  • Print_ISBN
    978-1-4673-3051-0
  • Type

    conf

  • DOI
    10.1109/ICCD.2012.6378625
  • Filename
    6378625