Title :
P4J-3 Dip-Type Liquid-Phase Sensor Using SH-SAW
Author :
Kogai, Takashi ; Yatsuda, Hiromi ; Shiokawa, S.
Author_Institution :
Japan Radio Co. Ltd., Fujimino
Abstract :
This paper describes an SH-SAW based sensor device which can be directly dipped into a liquid. The sensor device is composed of a two-channel SH-SAW delay line on a 36Y-X LiTaO3. Those IDTs are surrounded with epoxy walls with a 50 mum height and a 160 mum thickness. Since the epoxy walls are constructed by a photo-lithography technique using a thick epoxy based photo resist, the thickness of wall can be minimized and as a result the SH-SAW propagation loss due to the walls can be minimized. Glass covers with an epoxy adhesive are attached onto the walls. Then air-cavities above the IDTs can be achieved and the IDTs can be perfectly isolated from the liquid. In this paper, experimental results of 50 MHz dip-type SH-SAW sensors on 36Y-X LiTaO3 are presented. Since the SH-SAW which propagates on the un-metallized propagation area in a liquid with a low permittivity attenuates due to surface skimming bulk wave excitation, the obtained permittivity and conductivity are slightly different from the exact values. In order to improve this drawback, a compensation method is presented.
Keywords :
epoxy insulation; interdigital transducers; microsensors; photolithography; surface acoustic wave delay lines; surface acoustic wave sensors; surface acoustic waves; ultrasonic transducers; IDT; LiTaO3; SH-SAW propagation loss; air cavities above; dip-type liquid-phase sensor; electrical conductivity; epoxy adhesive; epoxy walls; frequency 50 MHz; permittivity; photolithography; photoresist; shear horizontal surface acoustic wave based sensor; surface skimming bulk wave excitation; two-channel SH-SAW delay line; Acoustic sensors; Conductivity; Costs; Delay; Electromechanical sensors; Mechanical factors; Metallization; Permittivity; Sensor phenomena and characterization; Sensor systems;
Conference_Titel :
Ultrasonics Symposium, 2007. IEEE
Conference_Location :
New York, NY
Print_ISBN :
978-1-4244-1384-3
Electronic_ISBN :
1051-0117
DOI :
10.1109/ULTSYM.2007.526