DocumentCode
2480906
Title
Thermoelectric microsensor for heat flux measurement
Author
Völklein, Friedemann ; Kessler, Ernst
Author_Institution
Fac. of Phys. Technol., Univ. of Appl. Sci. Wiesbaden, Russelsheim, Germany
fYear
1998
fDate
24-28 May 1998
Firstpage
214
Lastpage
217
Abstract
We present a new microsensor for heat flux measurement. The sensor is prepared by using thin Bi1-xSbx films. which are patterned by photolithography. The films are deposited on 800 nm thin membranes of silicon oxide/silicon nitride. Which are structurized by micromachining (anisotropic etching of silicon wafers). The sensor consists of ten membranes with 889 thermocouples on each membrane. The high density of thermocouples on a small membrane size of 22 mm2 enables the high sensitivity of 5,87 mV/(W/m2), whereas the sensitivity of conventional heat flux sensors is only 0.07 mV/(W/m2). This increase is achieved by the microlithographic design. The results of the sensor modelling and the design optimization are presented. The sensor can be calibrated absolutely by using an integrated thin-film heater, which generates a well-defined heat flux (self-calibration)
Keywords
antimony alloys; bismuth alloys; heat measurement; micromachining; microsensors; photolithography; thermocouples; BiSb; Si; anisotropic etching; design optimization; heat flux measurement; integrated thin-film heater; microlithographic design; micromachining; photolithography; self-calibration; sensor modelling; thermocouples; thermoelectric microsensor; thin films; thin membranes; Biomembranes; Bismuth; Lithography; Micromachining; Microsensors; Semiconductor films; Silicon; Thermal sensors; Thermoelectricity; Thin film sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1998. Proceedings ICT 98. XVII International Conference on
Conference_Location
Nagoya
ISSN
1094-2734
Print_ISBN
0-7803-4907-5
Type
conf
DOI
10.1109/ICT.1998.740355
Filename
740355
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