DocumentCode
2481278
Title
Some properties of Re2Te5-based materials
Author
Caillat, T. ; Chung, S. ; Fleurial, J.-P. ; Snyder, G.J. ; Borshchevsky, A.
Author_Institution
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear
1998
fDate
24-28 May 1998
Firstpage
298
Lastpage
301
Abstract
Re2Te5 is a semiconducting compound with an energy band gap of about 0.8 eV. It has a relatively complex crystal structure with 84 atoms per unit cell. Initial results obtained at the Jet Propulsion Laboratory on p-type polycrystalline samples showed that they possess large Seebeck coefficient values but also large electrical resistivity values. They also exhibit very low thermal conductivity with a room temperature value of 13 mW/cmK. Another attractive feature of Re 2Te5 is the possibility of inserting a variety of atoms in the large voids (2.8 Å in diameter) of the crystal structure to form Re6M2Te15 filled compositions. The void fillers could act as phonon scattering centers, further reducing the thermal conductivity in these materials. As part of an effort to evaluate the potential of Re2Te5-based materials for thermoelectric applications, we are currently exploring the synthesis and properties of filled compositions as well as n-type Re2Te5 samples. We present and discuss in this paper initial results obtained on Fe and Ag doped Re2Te5 samples
Keywords
Seebeck effect; crystal structure; electrical resistivity; energy gap; iron; rhenium compounds; semiconductor materials; silver; thermal conductivity; 0.8 eV; Re2Te5-based materials; Re2Te5:Ag; Re2Te5:Fe; energy band gap; large Seebeck coefficient; large electrical resistivity; phonon scattering centers; very low thermal conductivity; void fillers; Conducting materials; Electric resistance; Laboratories; Phonons; Photonic band gap; Propulsion; Semiconductivity; Tellurium; Temperature; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1998. Proceedings ICT 98. XVII International Conference on
Conference_Location
Nagoya
ISSN
1094-2734
Print_ISBN
0-7803-4907-5
Type
conf
DOI
10.1109/ICT.1998.740377
Filename
740377
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