DocumentCode :
2481537
Title :
Hydrogel optimization towards fibroblast-friendly biomimetic coatings for implantable devices
Author :
Linde, A. Sánchez ; O´Callaghan, J.M. ; De Beeck, M. Op ; Neves, H. Pereira ; Van Hoof, C. ; Mertens, R.
Author_Institution :
IMEC, Leuven, Belgium
fYear :
2011
fDate :
Aug. 30 2011-Sept. 3 2011
Firstpage :
2870
Lastpage :
2873
Abstract :
In this paper we present our investigations related to the optimization of hydrogels for the coating/packaging of biomedical devices. In order for hydrogels to be a viable interface/packaging material, a number of conditions must be met. We outline the tailoring of the mechanical properties of a HEMA based hydrogel by exploiting the influence of individual hydrogel components to achieve these requirements. The water sorption, the elasticity and the porosity of various hydrogel materials were tested and the effects of the different hydrogel components was determined. These components include gelatin (used as a pore generator or porogen), alginate (to influence mechanical properties) and collagen (to improve cell adhesion). We also report the results of in vitro fibroblast testing on various hydrogel types.
Keywords :
adhesion; biomechanics; biomedical equipment; biomedical materials; biomimetics; cellular biophysics; coatings; elasticity; gelatin; hydrogels; molecular biophysics; optimisation; porosity; sorption; HEMA based hydrogel; alginate; biomedical device; cell adhesion; coating-packaging; collagen; elasticity; fibroblast-friendly biomimetic coatings; gelatin; hydrogel materials; hydrogel optimization; implantable device; in-vitro fibroblast testing; interface-packaging material; mechanical properties; porosity; water sorption; Fibroblasts; Fluids; Mechanical factors; Scanning electron microscopy; Testing; Biomimetics; Cell Proliferation; Fibroblasts; Hydrogels; Methacrylates; Microscopy, Electron, Scanning;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
Conference_Location :
Boston, MA
ISSN :
1557-170X
Print_ISBN :
978-1-4244-4121-1
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2011.6090792
Filename :
6090792
Link To Document :
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