DocumentCode
2481654
Title
A system-level VLSI platform for optical interconnection insertion
Author
Hornak, L.A. ; Tewksbury, S.K.
Author_Institution
Dept. of Electr. & Comput. Eng., West Virginia Univ., Morgantown, WV, USA
fYear
1993
fDate
15-18 Nov 1993
Firstpage
460
Lastpage
461
Abstract
The present paper will briefly review issues in the context of overall intelligent optical interconnection module (IOIM) pair design needs. Emphasis will be given to present design efforts on the electronic virtual optical alignment (EVOA) system with discussion of design results and trade-offs regarding the externally controlled detector array and the array switching network architecture
Keywords
VLSI; integrated circuit packaging; optical design techniques; optical interconnections; optical switches; optical workshop techniques; switching networks; array switching network architecture; design results; electronic virtual optical alignment system; externally controlled detector array; intelligent optical interconnection module pair design; optical interconnection insertion; review; system-level VLSI platform; Circuits; Fault detection; Optical arrays; Optical design; Optical devices; Optical interconnections; Optical receivers; Packaging; Sensor arrays; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1993. LEOS '93 Conference Proceedings. IEEE
Conference_Location
San Jose, CA
Print_ISBN
0-7803-1263-5
Type
conf
DOI
10.1109/LEOS.1993.379259
Filename
379259
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