Title :
Packaging for fiber in board electro-optical interconnection
Author :
Delbare, Wim ; Lauwers, Erik ; Qingsheng, Tan ; Vandewege, Jan ; Verbeke, Jan
Author_Institution :
Lab. of Electromagn. & Acoust., Ghent Univ., Belgium
Abstract :
The fiber in board electro-optical interconnection system is developed to meet the interconnection requirements of broadband exchanges. The paper briefly describes the interconnection problem inside broadband exchanges. The principles of the fiber in board technology are made clear. The design of a fiber in board compatible multifiber package is described
Keywords :
broadband networks; integrated optoelectronics; optical communication equipment; optical fibre communication; optical interconnections; packaging; broadband exchanges; design; fiber in board compatible multifiber package; fiber in board electro-optical interconnection; fiber in board technology; packaging; Glass; High speed optical techniques; Integrated circuit interconnections; Optical crosstalk; Optical fiber cables; Optical fibers; Optical interconnections; Optical receivers; Optical surface waves; Packaging;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1993. LEOS '93 Conference Proceedings. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-1263-5
DOI :
10.1109/LEOS.1993.379264
