Title :
New 3D low loss, wide band microwave interconnection
Author :
Monfraix, P. ; Coello Vera, A. ; Llopis, O. ; Ulian, P. ; George, S. ; Drevon, C. ; Tronche, C. ; Graffeuil, J.
Author_Institution :
ALCATEL TELECOM, Toulouse, France
Abstract :
This paper describes a new wide band [0; 40 GHz] vertical interconnection approach between two RF homogeneously grounded coplanar lines. It can be considered as two 90/spl deg/ vertical bends transition. Both electromagnetic simulation and measurement demonstrate very good results on the whole frequency range.
Keywords :
integrated circuit interconnections; microwave integrated circuits; 0 to 40 GHz; 3D low loss wide band microwave interconnection; RF homogeneously grounded coplanar line; electromagnetic simulation; vertical bends transition; Costs; Electromagnetic measurements; Frequency measurement; Magnetic materials; Microstrip resonators; Probes; Radar; Radio frequency; Telecommunications; Wideband;
Conference_Titel :
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3814-6
DOI :
10.1109/MWSYM.1997.596638
