Title :
An examination of the metallic bonding of a clad material and two gold plating systems under constant force fretting conditions
Author :
Aukland, Neil ; Hardee, Harry ; Wehr, Anna ; Brennan, Sean ; Lees, Philip
Author_Institution :
Adv. Interconnection Lab., New Mexico State Univ., Las Cruces, NM, USA
Abstract :
Metallic bonding (cold welding) comparisons were made between a clad and two different gold plated contact materials under constant force fretting conditions. Previous experiments conducted at the Advanced Interconnections Laboratory showed that various material systems had different tendencies for metallic bonding. Three different material systems were selected to study this phenomenon. They were a thick gold plating, a gold flash over 80% palladium 20% nickel and a clad material (WE 1 over R156). Four different normal forces: 20, 50, 100 and 200 grams were used in this research project. Contact resistance data were collected using a four-wire measurement system with the open circuit voltage limited to 0.02 volts. Relative humidity was controlled to be 40%. The procedure for each experiment was as follows: tangential force was increased until the static coefficient of friction was exceeded, then a constant displacement was maintained until a wear track was established, then a constant force was maintained throughout the remainder of the experiment. Two sets of data were collected during each experiment: fret amplitude and contact resistance. The three material systems were statistically compared using analysis of variance techniques. They were compared on the number of fretting cycles needed to stop fretting motion, after a wear track was established.
Keywords :
claddings; contact resistance; electroplating; friction; gold; wear; welding; Au-PdNi; clad material; cold welding; constant force fretting; contact material; contact resistance; four-wire measurement; fret amplitude; friction; gold flash; gold plating; metallic bonding; relative humidity; variance analysis; wear track; Bonding forces; Conducting materials; Contact resistance; Gold; Inorganic materials; Integrated circuit interconnections; Laboratories; Nickel; Palladium; Welding;
Conference_Titel :
Electrical Contacts, 1997., Proceedings of the Forty-Third IEEE Holm Conference on
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-3968-1
DOI :
10.1109/HOLM.1997.637870