DocumentCode
2482140
Title
Thermoelectric properties of segmented Bi2Te3/PbTe
Author
Koshigoe, M. ; Kudo, Y. ; Hashimoto, M. ; Shiota, I. ; Nishida, I.A.
Author_Institution
Kogakuin Univ., Tokyo, Japan
fYear
1998
fDate
24-28 May 1998
Firstpage
479
Lastpage
482
Abstract
The sintered Bi2Te3 and PbTe compounds were joined by soldering with flux to form segmented materials. The joining with flux was performed under 2 MPa at 650 K for 10s in a N2 atmosphere. Soldering with ultrasonic wave was also attempted. Te-Ag eutectic alloy was used as the solder. SEM observation revealed that the solder did not form any undesirable layer in the vicinity of the joined part in both segmented materials formed by both soldering ways. No remarkable increase in resistivity was observed at the interface. The segmented materials showed higher power factor than each monolithic material at the temperature range between 400 K and 650 K
Keywords
bismuth compounds; functionally graded materials; lead compounds; scanning electron microscopy; sintering; soldering; thermoelectric conversion; thermoelectricity; 10 s; 2 MPa; 400 to 650 K; Bi2Te3-PbTe; EDX; Hall coefficient; N2; SEM observation; Seebeck coefficient; Te-Ag; Te-Ag eutectic alloy; elemental distribution; flux; functionally graded materials; morphology; power factor; resistance; resistivity; segmented Bi2Te3/PbTe; sintered Bi2Te3; sintered PbTe; soldering; thermoelectric properties; ultrasonic wave soldering; Atmosphere; Bismuth; Conductivity; Inorganic materials; Joining materials; Raw materials; Soldering; Tellurium; Temperature distribution; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1998. Proceedings ICT 98. XVII International Conference on
Conference_Location
Nagoya
ISSN
1094-2734
Print_ISBN
0-7803-4907-5
Type
conf
DOI
10.1109/ICT.1998.740422
Filename
740422
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