DocumentCode :
2482345
Title :
Simulation of partial discharge within a void under square waveform applied voltage
Author :
Illias, H.A. ; Bakar, A.H.A. ; Mokhlis, H. ; Tunio, M.A. ; Chen, G. ; Lewin, P.L. ; Ariffin, A.M.
Author_Institution :
Electr. Eng. Dept., Univ. of Malaya, Kuala Lumpur, Malaysia
fYear :
2012
fDate :
14-17 Oct. 2012
Firstpage :
76
Lastpage :
79
Abstract :
Partial discharge (PD) activity within a void in a dielectric material is influenced by many factors. One of the factors is the applied voltage waveform on the material. In this paper, a two-dimensional (2D) model of a cylindrical void in polyethylene layers has been developed using finite element analysis (FEA) software. The model was used to simulate PD activity in the void under square waveform applied voltage. The obtained simulation results were compared with the measurement results from literature. It was found that both results are within reasonable agreement but with only slight disagreement. From comparison, critical parameters from the model affecting PD activity under square waveform applied voltage were identified; they include the inception and extinction voltages and electron generation rate. This finding may increase an understanding of PD behaviour within a void in a dielectric material under square waveform applied voltage.
Keywords :
dielectric materials; finite element analysis; partial discharges; voids (solid); 2D model; FEA software; PD activity; cylindrical void; dielectric material; electron generation rate; extinction voltages; finite element analysis; inception voltages; partial discharge simulation; polyethylene layers; square waveform applied voltage; two-dimensional model; Dielectric materials; Electric fields; Electrodes; Partial discharges; Polyethylene; Simulation; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location :
Montreal, QC
ISSN :
0084-9162
Print_ISBN :
978-1-4673-1253-0
Electronic_ISBN :
0084-9162
Type :
conf
DOI :
10.1109/CEIDP.2012.6378726
Filename :
6378726
Link To Document :
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