Title :
Vessel extraction using anisotropic minimal paths and path score
Author :
Da Chen ; Cohen, L.D. ; Mirebeau, J.-M.
Author_Institution :
CEREMADE, Univ. Paris Dauphine PSL*, Paris, France
Abstract :
Geodesic methods have been widely applied to image analysis [1]. They are particularly efficient to extract a tubular structure, such as a blood vessel, given its two endpoints in a 2D or 3D medical image [2]. We address here a more difficult problem: the extraction of a full vessel tree structure given a single initial root, by growing a collection of keypoints, connected by geodesic minimal paths as in [3]. Keypoints are iteratively added, using selection criteria which compare geodesic distances with the standard euclidean curve length and a path score. A weakness of existing approaches is that the geodesic length and the euclidean path length are locally proportional, due to the use of an isotropic geodesic potential P(x). In contrast, we use an anisotropic geodesic potential P(x, v), and develop new criteria for selecting keypoints and stopping the tree growth. Experimental results demonstrate that our method can extract vessel structures at a finer scale, with increased accuracy.
Keywords :
biomedical MRI; blood vessels; differential geometry; feature extraction; medical image processing; 2D medical image; 3D medical image; anisotropic geodesic potential; anisotropic minimal paths; blood vessel; euclidean path length; full vessel tree structure; geodesic distances; geodesic length; geodesic methods; geodesic minimal paths; image analysis; isotropic geodesic potential; keypoint collection; path score; selection criteria; single initial root; standard euclidean curve length; tubular structure extraction; vessel extraction; Abstracts; Approximation algorithms; Approximation methods; Feature extraction; Measurement; Piecewise linear approximation; Three-dimensional displays; Anisotropic Fast Marching; Geodesic methods; Keypoints; Minimal Paths; Vessel extraction;
Conference_Titel :
Image Processing (ICIP), 2014 IEEE International Conference on
Conference_Location :
Paris
DOI :
10.1109/ICIP.2014.7025314