• DocumentCode
    2482563
  • Title

    Thermoelectric properties of sintered SiC/Si/Ag thermoelectric semiconductor

  • Author

    Inai, H. ; Okamoto, Y. ; Morimoto, J.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Defense Acad., Kanagawa, Japan
  • fYear
    1998
  • fDate
    24-28 May 1998
  • Firstpage
    578
  • Lastpage
    581
  • Abstract
    Silicon carbide is a wide gap semiconductor which is expected to be used in the high temperature region. It has large electrical resistivity and large thermal conductivity. These properties are not favorable for thermoelectric devices. In this paper, Si and Ag were selected as dopants to reduce the thermal conductivity and the electrical resistivity, respectively. These dopants were effective in improving the thermoelectric properties in our previous works. The thermoelectric properties of SiC/Si/Ag have been studied over temperatures ranging from room temperature to 750°C as a function of both Si concentration (10.0 wt.%~40.0 wt.%) and Ag concentration (1.0 wt.%~4.0 wt.%). The thermal conductivity and the electrical resistivity decreased with increasing temperature. The figure of merit Z approached 1.1×10-4 K-1 at around 750°C. We conclude that Si with Ag doped SiC is a promising thermoelectric material
  • Keywords
    electrical resistivity; silicon; silicon compounds; silver; thermal conductivity; thermoelectricity; wide band gap semiconductors; 20 to 750 degC; Ag concentration; Si concentration; SiC:Si,Ag; electrical resistivity; figure of merit; thermal conductivity; thermoelectric semiconductor; wide gap semiconductor; Conducting materials; Doping; Electric resistance; Semiconductor materials; Silicon carbide; Temperature distribution; Thermal conductivity; Thermal resistance; Thermoelectricity; Waste materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1998. Proceedings ICT 98. XVII International Conference on
  • Conference_Location
    Nagoya
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-4907-5
  • Type

    conf

  • DOI
    10.1109/ICT.1998.740445
  • Filename
    740445