DocumentCode :
2482860
Title :
Effect of electric field application during curing process on thermal conductivity of epoxy composite materials with low content inorganic particles
Author :
Kinoshita, Satoshi ; Kozako, Masahiro ; Hikita, Masayuki ; Tanaka, Toshikatsu
Author_Institution :
Kyushu Inst. of Technol., Kitakyushu, Japan
fYear :
2012
fDate :
14-17 Oct. 2012
Firstpage :
183
Lastpage :
190
Abstract :
The aim of this study is to improve both thermal conductivity and electrical insulation properties of the epoxy based composites. This paper deals with evaluation of condition of filler orientation by electric field application to improve thermal conductivity effectively. To discuss efficient preparation condition, 18 kinds of specimen containing different kinds of filler were fabricated with changing the duration of applied electric field from 0 to 180 min. We selected various kinds of fillers as follows: three kinds of specimens with plate-like alumina filler with 2, 5, 10 μm in size, and three kinds of agglomeration types of boron nitride. As a result, the thermal conductivity of the specimen of plate-like alumina of 10 μm in grain size was improved about twice as much as that with applied electric field, being found to be the most effective. Details of experimental methods and date are discussed in the paper.
Keywords :
alumina; boron compounds; composite insulating materials; curing; electric fields; epoxy insulators; filled polymers; grain size; thermal conductivity; Al2O3; BN; agglomeration; curing process; electric field application; electrical insulation; epoxy composite material; grain size; inorganic particle; plate-like alumina filler; size 10 mum; size 2 mum; size 5 mum; thermal conductivity; time 0 min to 180 min; Boron; Ceramics; Composite materials; Conductivity; Electric fields; Epoxy resins; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location :
Montreal, QC
ISSN :
0084-9162
Print_ISBN :
978-1-4673-1253-0
Electronic_ISBN :
0084-9162
Type :
conf
DOI :
10.1109/CEIDP.2012.6378752
Filename :
6378752
Link To Document :
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