DocumentCode :
2483142
Title :
Challenges in probing space charge at sub-micrometer scale
Author :
Teyssedre, G. ; Villeneuve, C. ; Pons, P. ; Boudou, L. ; Makasheva, K. ; Despax, B.
Author_Institution :
LAPLACE (Lab. Plasma et Conversion d´´Energie), Univ. de Toulouse, Toulouse, France
fYear :
2012
fDate :
14-17 Oct. 2012
Firstpage :
234
Lastpage :
237
Abstract :
An overview of current limitations and challenges with techniques, based either on acoustic or thermal perturbation, providing charge density profiles within insulations, is presented. Even though the resolution could be somewhat improved, technical limitations readily appear, related to the bandwidth of signals to be detected and to the sensitivity. Instead, our purpose here is to exploit near field techniques derived from AFM - Atomic Force Microscopy-. A booming of the availability and versatility of equipments is observed today. A spatial resolution of some tens of nanometers is accessible for charge detection which therefore let´s the possibility to investigate selectively regions with specific properties. The measuring conditions and operating mode for both the sensitivity and spatial resolution of the techniques are addressed and examples of application of these techniques to charge detection in insulating materials are presented.
Keywords :
atomic force microscopy; dielectric materials; insulation; perturbation techniques; AFM; acoustic perturbation; atomic force microscopy; charge density profiles; charge detection; equipments availability; insulating materials; solid dielectrics; space charge probing; spatial resolution; submicrometer scale; technical limitations; thermal perturbation; versatility; Dielectrics; Electrostatics; Force; Materials; Microscopy; Spatial resolution; Surface topography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location :
Montreal, QC
ISSN :
0084-9162
Print_ISBN :
978-1-4673-1253-0
Electronic_ISBN :
0084-9162
Type :
conf
DOI :
10.1109/CEIDP.2012.6378764
Filename :
6378764
Link To Document :
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