DocumentCode :
248356
Title :
Improving head and body pose estimation through semi-supervised manifold alignment
Author :
Heili, Alexandre ; Varadarajan, Jagannadan ; Ghanem, Bernard ; Ahuja, Narendra ; Odobez, Jean-Marc
Author_Institution :
Idiap Res. Inst., Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland
fYear :
2014
fDate :
27-30 Oct. 2014
Firstpage :
1912
Lastpage :
1916
Abstract :
In this paper, we explore the use of a semi-supervised manifold alignment method for domain adaptation in the context of human body and head pose estimation in videos. We build upon an existing state-of-the-art system that leverages on external labelled datasets for the body and head features, and on the unlabelled test data with weak velocity labels to do a coupled estimation of the body and head pose. While this previous approach showed promising results, the learning of the underlying manifold structure of the features in the train and target data and the need to align them were not explored despite the fact that the pose features between two datasets may vary according to the scene, e.g. due to different camera point of view or perspective. In this paper, we propose to use a semi-supervised manifold alignment method to bring the train and target samples closer within the resulting embedded space. To this end, we consider an adaptation set from the target data and rely on (weak) labels, given for example by the velocity direction whenever they are reliable. These labels, along with the training labels are used to bias the manifold distance within each manifold and to establish correspondences for alignment.
Keywords :
learning (artificial intelligence); pose estimation; domain adaptation; head and body pose estimation; semisupervised manifold alignment method; weak labels; Couplings; Estimation; Manifolds; Surveillance; Training; Vectors; Videos; domain adaptation; head and body pose; manifold; semi-supervised; surveillance; weak labels;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Image Processing (ICIP), 2014 IEEE International Conference on
Conference_Location :
Paris
Type :
conf
DOI :
10.1109/ICIP.2014.7025383
Filename :
7025383
Link To Document :
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