• DocumentCode
    2483590
  • Title

    Process influence on the moisture absorption in a polymer nanocomposite

  • Author

    Saysouk, F. ; Diaham, S. ; Locatelli, M.-L. ; Schlegel, B. ; Salles, V. ; Valdez-Nava, Z. ; Kozako, M. ; Lebey, T. ; Flahaut, E.

  • Author_Institution
    INPT, Univ. de Toulouse; UPS, Toulouse, France
  • fYear
    2012
  • fDate
    14-17 Oct. 2012
  • Firstpage
    327
  • Lastpage
    330
  • Abstract
    A polymer nanocomposite (P-NC) has been manufactured using different processes based on ultrasonication (US) and particles surface treatment. The moisture absorption was detected with different characterization method such as Fourier transform infrared spectroscopy, isothermal thermogravimetric analysis and electrical characterizations. The use of particle surface treatment allows decreasing O-H absorption into P-NC. Moreover, an efficient US process has been found to improve the P-NC hydrophobicity. The desorption kinetics of moisture has also been studied for different P-NC preparation processes, using isothermal characterizations at 150°C. By controlling the chemical surface state of the nanofillers and the dispersion, it was observed a good stability of the conduction current density, in the same order of that of the base polymer.
  • Keywords
    Fourier transform spectroscopy; current density; desorption; filled polymers; hydrophobicity; infrared spectroscopy; moisture; nanofabrication; polymer insulators; surface states; surface treatment; thermal analysis; Fourier transform infrared spectroscopy; P-NC preparation process; base polymer; chemical surface state control; conduction current density; electrical characterizations; hydrophobicity; isothermal thermogravimetric analysis; moisture absorption; nanofiller; particle surface treatment; polymer nanocomposite; temperature 150 degC; ultrasonication; Absorption; Current density; Isothermal processes; Moisture; Polymers; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
  • Conference_Location
    Montreal, QC
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4673-1253-0
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2012.6378787
  • Filename
    6378787