DocumentCode
2483920
Title
A new mechanism to deal with process variability in NoC links
Author
Hernández, Carles ; Silla, Federico ; Santonja, Vicente ; Duato, José
Author_Institution
Parallel Archit. Group, Univ. Politec. de Valencia, Valencia, Spain
fYear
2009
fDate
23-29 May 2009
Firstpage
1
Lastpage
11
Abstract
Associated with the ever growing integration scale of VLSI technologies is the increase in process variability, which makes silicon devices to become less predictable. In the context of network-on-chip (NoC), this variability affects the maximum frequency that could be sustained by each wire of the link that interconnects two cores in a CMP system. Reducing the clock frequency so that all wires can properly work is a trivial solution but, as variability increases, this approach causes an unacceptable performance penalty. In this paper, we propose a new technique to deal with the effects of variability on the links of the NoC that interconnects cores in a CMP system. This technique, called Phit Reduction (PR), retrieves most of the bandwidth still available in links containing wires that are not able to operate at the designed operating frequency. More precisely, our mechanism discards these slow wires and uses all the wires that can work at the design frequency. Two implementations are presented: Local Phit Reduction (LPR), oriented to fabrication processes with very high variability, which requires more hardware but provides higher performance; and Global Phit Reduction (GPR), that requires less additional hardware but is not able to extract all the available bandwidth. The performance evaluation presented in the paper confirms that LPR obtains good results both for low and high variability scenarios. Moreover, in most of our experiments LPR practically achieves the same performance than the ideal network. On the other hand, GPR is appropriate for systems where whithin-die variations are expected to be low.
Keywords
VLSI; integrated circuit interconnections; integrated circuit manufacture; microprocessor chips; network-on-chip; CMP system; NoC links; VLSI technology; clock frequency; fabrication processes; global phit reduction; local phit reduction; network-on-chip; operating frequency; performance evaluation; process variability; silicon devices; Bandwidth; Clocks; Fabrication; Frequency; Ground penetrating radar; Hardware; Network-on-a-chip; Silicon devices; Very large scale integration; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel & Distributed Processing, 2009. IPDPS 2009. IEEE International Symposium on
Conference_Location
Rome
ISSN
1530-2075
Print_ISBN
978-1-4244-3751-1
Electronic_ISBN
1530-2075
Type
conf
DOI
10.1109/IPDPS.2009.5161048
Filename
5161048
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