• DocumentCode
    2484689
  • Title

    Evaluating nano composites for high voltage applications

  • Author

    Iyer, G. ; Gorur, R.S. ; Krivda, A.

  • Author_Institution
    Sch. of Electr., Energy & Comput. Eng., Arizona State Univ., Tempe, AZ, USA
  • fYear
    2012
  • fDate
    14-17 Oct. 2012
  • Firstpage
    569
  • Lastpage
    572
  • Abstract
    A thermal model developed in this paper provides a plausible explanation to the improved corona resistance performance of nanocomposites. The model calculates the localized temperatures for different filler concentrations. Lower localized temperatures are achieved even at low nanofiller concentrations due to well dispersed nanofillers. This leads to better heat dissipation from the sample surface which is instrumental in higher discharge endurance of epoxy nanocomposites. Mechanical testing of the samples is conducted to evaluate the tensile strength and the stiffness (Young´s modulus) of the samples. The results showed that the nanocomposites demonstrated an equivalent tensile strength as the microcomposites while retaining the flexibility of the unfilled sample.
  • Keywords
    Young´s modulus; cooling; corona; mechanical testing; nanocomposites; tensile strength; Young´s modulus; corona resistance performance; epoxy nanocomposites; heat dissipation; high voltage insulation applications; low nanofiller concentrations; lower localized temperatures; mechanical testing; microcomposites; nanocomposite evaluation; stiffness; tensile strength; thermal model; Finite element methods; Insulation; Mathematical model; Nanocomposites; Temperature measurement; Young´s modulus;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
  • Conference_Location
    Montreal, QC
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4673-1253-0
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2012.6378844
  • Filename
    6378844