DocumentCode
2484689
Title
Evaluating nano composites for high voltage applications
Author
Iyer, G. ; Gorur, R.S. ; Krivda, A.
Author_Institution
Sch. of Electr., Energy & Comput. Eng., Arizona State Univ., Tempe, AZ, USA
fYear
2012
fDate
14-17 Oct. 2012
Firstpage
569
Lastpage
572
Abstract
A thermal model developed in this paper provides a plausible explanation to the improved corona resistance performance of nanocomposites. The model calculates the localized temperatures for different filler concentrations. Lower localized temperatures are achieved even at low nanofiller concentrations due to well dispersed nanofillers. This leads to better heat dissipation from the sample surface which is instrumental in higher discharge endurance of epoxy nanocomposites. Mechanical testing of the samples is conducted to evaluate the tensile strength and the stiffness (Young´s modulus) of the samples. The results showed that the nanocomposites demonstrated an equivalent tensile strength as the microcomposites while retaining the flexibility of the unfilled sample.
Keywords
Young´s modulus; cooling; corona; mechanical testing; nanocomposites; tensile strength; Young´s modulus; corona resistance performance; epoxy nanocomposites; heat dissipation; high voltage insulation applications; low nanofiller concentrations; lower localized temperatures; mechanical testing; microcomposites; nanocomposite evaluation; stiffness; tensile strength; thermal model; Finite element methods; Insulation; Mathematical model; Nanocomposites; Temperature measurement; Young´s modulus;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location
Montreal, QC
ISSN
0084-9162
Print_ISBN
978-1-4673-1253-0
Electronic_ISBN
0084-9162
Type
conf
DOI
10.1109/CEIDP.2012.6378844
Filename
6378844
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