• DocumentCode
    2484719
  • Title

    Applying optical interconnects to electronic systems. Promise vs. practicality

  • Author

    Bristow, Julian ; Lehman, John ; Hibbs-Brenner, Mary ; Liu, Yue

  • Author_Institution
    Honeywell Technol. Centre, Minneapolis, MN, USA
  • fYear
    1997
  • fDate
    22-24 June 1997
  • Firstpage
    54
  • Lastpage
    59
  • Abstract
    Optical interconnects have long promised to solve a number of problems assumed to exist in electronic systems. A wealth of technology exists in the area, yet few electronic systems today employ optical interconnects. In many cases, it is the cost of optical interconnects which prevents their widespread adoption, as little fundamental advantage is offered by most applications of optical interconnects. The decreasing cost of optoelectronic technology and of its incorporation into electronic systems will enable further penetration of the market. Plastic fiber is likely to provide a competitive solution for intercabinet interconnects, while both high density fiber backplanes and polymer backplanes are likely to impact first high performance computer systems and eventually a broader range of systems, while free space interconnects will facilitate both advanced versions of existing architectures and the implementation of new systems. The key to practical implementation lies in providing transparency to the system integrator to minimize the departure from established practices. Significant progress is also being made in a new direction in which the inherent advantages of optics can be exploited in unique architectures, while still implementing logic functions in electronics, however such systems are unlikely to find widespread use in the near future.
  • Keywords
    optical interconnections; technological forecasting; electronic systems; high density fiber backplanes; high performance computer systems; intercabinet interconnects; optical interconnects; optoelectronic technology; plastic fiber; polymer backplanes; Backplanes; Bandwidth; Copper; Costs; Electronics packaging; Integrated circuit interconnections; LAN interconnection; Optical fiber cables; Optical interconnections; Optical signal processing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Massively Parallel Processing Using Optical Interconnections, 1997., Proceedings of the Fourth International Conference on
  • Print_ISBN
    0-8186-7975-1
  • Type

    conf

  • DOI
    10.1109/MPPOI.1997.609094
  • Filename
    609094