• DocumentCode
    2485100
  • Title

    A comparative study of thermal effects on cold rolled copper induced by cathode spots and short laser pulses

  • Author

    Franz, U. ; Lepski, D. ; Siemroth, P.

  • Author_Institution
    Fraunhofer Inst. Mater. & Beam Technol., Dresden, Germany
  • Volume
    1
  • fYear
    1998
  • fDate
    17-21 Aug 1998
  • Firstpage
    268
  • Abstract
    Heat-induced structural changes within the cathode material caused by vacuum arc spots were studied by scanning electron microscopy in order to obtain information on the temperature field and the active spot life time. Cold rolled copper was chosen as the cathode material because of its low recrystallization temperature and its fine grain structure. These structural changes were compared to those obtained by irradiating the same material with laser pulses of definite duration and energy. In the latter case, heat conduction and evaporation as well as the removal of melt by the vapor pressure acting on the surface were simulated numerically. The comparison of ablation rates, heat-affected zones and simulation results for laser irradiation and for the arc spot allows conclusions to the unknown active life time of the arc spots
  • Keywords
    cathodes; cold rolling; copper; scanning electron microscopy; vacuum arcs; Cu; ablation rates; active spot life time; cathode material; cold rolled copper; fine grain structure; heat-affected zones; heat-induced structural changes; laser irradiation; recrystallization temperature; scanning electron microscopy; temperature field; vacuum arc spots; Cathodes; Conducting materials; Copper; Laser ablation; Laser transitions; Optical materials; Optical pulses; Scanning electron microscopy; Temperature; Vacuum arcs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 1998. Proceedings ISDEIV. XVIIIth International Symposium on
  • Conference_Location
    Eindhoven
  • ISSN
    1093-2941
  • Print_ISBN
    0-7803-3953-3
  • Type

    conf

  • DOI
    10.1109/DEIV.1998.740623
  • Filename
    740623