Title :
Suppression of power/ground noise using meshed-planar electromagnetic bandgap (MP-EBG) structure for Ultra-Wideband (UWB) System-in-Package (SiP)
Author :
Kim, Myunghoi ; Yoon, Changwook ; Koo, Kyoungchoul ; Hwang, Chulsoon ; Sung, Hajin ; Kim, Joungho
Author_Institution :
Dept. of EE, KAIST, Daejeon, South Korea
Abstract :
In this paper, we propose the meshed-planar electromagnetic bandgap (MP-EBG) structure with a meshed planar surface embedded in the package power plane to suppress a power/ground noise in the frequency range from 3.1 GHz to 10.6 GHz, also known as the frequency band of Ultra-Wideband (UWB). The MP-EBG structure has two different EBG surfaces. One surface is a mushroom-like surface embedded between a package power and a ground plane and the other surface is a meshed planar structure embedded in a package power plane. The MP-EBG structure enables to enhance the bandwidth of the stopband in the limited package area and achieve the 8.7 GHz stop bandwidth with -30 dB isolation.
Keywords :
interference suppression; photonic band gap; system-in-package; ultra wideband technology; EBG surfaces; MP-EBG structure; UWB SiP; frequency band; ground plane; limited package area; meshed planar structure; meshed planar surface; meshed-planar electromagnetic bandgap; mushroom-like surface; package power plane; power/ground noise suppression; ultra-wideband system-in-package; Bandwidth; Impedance; Metamaterials; Noise; Periodic structures; Simulation; Ultra wideband technology;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location :
Fort Lauderdale, FL
Print_ISBN :
978-1-4244-6305-3
DOI :
10.1109/ISEMC.2010.5711241
