• DocumentCode
    2485242
  • Title

    Effect of temperature and electron energy on volume resistivity of a polyimide film in a space environment

  • Author

    Watanabe, R. ; Miyake, H. ; Okumura, T. ; Takahashi, M.

  • Author_Institution
    Tokyo City Univ., Tokyo, Japan
  • fYear
    2012
  • fDate
    14-17 Oct. 2012
  • Firstpage
    673
  • Lastpage
    676
  • Abstract
    In this study, we develop a system for measuring the volume resistivity of a polyimide film in a simulated space environment and investigate the effect of sample temperature and incident electron beam energy on the volume resistivity of the film. The temperatures in the experiment range from 233 K to 353 K and are controlled by a temperature control system that uses Peltier devices. The incident electron energy is varied from 10 keV to 40 keV. The experimental results indicate that volume resistivity of the polyimide film decreases as its temperature increases in line with the Boltzmann model. The higher energy electrons penetrate deep into the experimental sample of spacecraft surface material and enhance conductivity, which results in a decrease in volume resistivity owing to radiation-induced conductivity (RIC).
  • Keywords
    polymer films; space vehicles; temperature control; Boltzmann model; Peltier devices; RIC; electron volt energy 10 keV to 40 keV; incident electron beam energy; polyimide film; radiation-induced conductivity; space environment; spacecraft surface material; temperature 233 K to 353 K; temperature control system; temperature effect; volume resistivity measurement; Conductivity; Dielectrics; Electric potential; Radiation effects; Temperature control; Temperature distribution; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
  • Conference_Location
    Montreal, QC
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4673-1253-0
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2012.6378870
  • Filename
    6378870