Title :
Scanning electron microscopy characterization of connector failures
Author :
Marshall, James L.
Author_Institution :
Dept. of Chem./Mater. Sci., North Texas Univ., Denton, TX, USA
Abstract :
The characterization of connector failures by scanning electron microscopy/energy dispersive X-ray (SEM/EDX) is described. The advantages of SEM/EDX over optical inspection are discussed. Three types of failures are covered: (1) migration of base metal to the surface, leading to corrosion at the contact area; and (2) fretting corrosion; (3) microcracking at the surface or at a barrier layer, exposing the base metal
Keywords :
X-ray chemical analysis; electric connectors; failure analysis; scanning electron microscopy; EDX; SEM; characterization; connector failures; corrosion; energy dispersive X-ray; fretting corrosion; microcracking; migration of base metal; optical inspection; scanning electron microscopy; types of failures; Connectors; Copper; Scanning electron microscopy; Tin;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ECC.1988.12593
